Members of our research group (prof. dr hab. inż. Jarosław Domaradzki; dr hab. inż. Damian Wojcieszak; dr hab. inż. Michał Mazur) took part in a project meeting held in Gijón, Spain – the headquarters of MicruX Fluidic, S.L., one of the partners of the M-Era.Net Call 2022 project “Copper conductive lines with glass insulation by a melt extrusion process” (CoCo).

The project is being carried out in collaboration with:
- Fraunhofer Institute for Machine Tools and Forming Technology (IWU), Germany
- Institute for Machine Elements, Engineering Design and Manufacturing and Institute of Glass Science and Technology, Technische Universität Bergakademie Freiberg (TUBAF), Germany
- Wrocław University of Science and Technology, Faculty of Electronics, Photonics and Microsystems, Department of Electronic and Photonic Metrology, Thin Film Technology Group
- MicruX Fluidic, S.L., Spain

The main objective of the CoCo project is to develop innovative multifunctional materials for electronic and sensing applications, combining copper as a highly conductive material with glass as a dielectric. Leveraging the unique properties of the copper–glass interface is expected to enhance the versatility, temperature stability, and mechanical and chemical robustness of next-generation electronic devices.

During the meeting, the partners presented the current progress of work on selective copper deposition on glass substrates using the melt extrusion technique and discussed recent results on improving copper–glass adhesion. Plans for joint publications and conference presentations were also outlined.

As part of the visit, the consortium had the opportunity to explore the R&D facilities of MicruX, the industrial partner of the project, and to discuss perspectives for the application of the project’s results.